Net and Pin Distribution for 3D Package Global Routing. - Jacob R. Minz; Mohit Pathak; Sung Kyu Lim (DATE, 2004)

Thermal-aware Steiner routing for 3D stacked ICs. - Mohit Pathak; Sung Kyu Lim (ICCAD, 2007)

Placement and routing of RF embedded passive designs in LCP substrate. - Mohit Pathak; Souvik Mukherjee; Madhavan Swaminathan; Ege Engin; Sung Kyu Lim (ICCD, 2007)

Performance and Thermal-Aware Steiner Routing for 3-D Stacked ICs. - Mohit Pathak; Sung Kyu Lim (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2009)

Design and analysis of 3D-MAPS: A many-core 3D processor with stacked memory. - Michael B. Healy; Krit Athikulwongse; Rohan Goel; Mohammad M. Hossain; Dae Hyun Kim 004; Young-Joon Lee; Dean L. Lewis; Tzu-Wei Lin; Chang Liu 034; Moongon Jung; Brian Ouellette; Mohit Pathak; et al. (CICC, 2010)

Through-silicon-via management during 3D physical design: When to add and how many? - Mohit Pathak; Young-Joon Lee; Thomas Moon; Sung Kyu Lim (ICCAD, 2010)

Electromigration modeling and full-chip reliability analysis for BEOL interconnect in TSV-based 3D ICs. - Mohit Pathak; Jiwoo Pak; David Z. Pan; Sung Kyu Lim (ICCAD, 2011)

Design for manufacturability and reliability for TSV-based 3D ICs. - David Z. Pan; Sung Kyu Lim; Krit Athikulwongse; Moongon Jung; Joydeep Mitra; Jiwoo Pak; Mohit Pathak; Jae-Seok Yang (ASP-DAC, 2012)

Exploiting die-to-die thermal coupling in 3D IC placement. - Krit Athikulwongse; Mohit Pathak; Sung Kyu Lim (DAC, 2012)

3D-MAPS: 3D Massively parallel processor with stacked memory. - Dae Hyun Kim 004; Krit Athikulwongse; Michael B. Healy; Mohammad M. Hossain; Moongon Jung; Ilya Khorosh; Gokul Kumar; Young-Joon Lee; Dean L. Lewis; Tzu-Wei Lin; Chang Liu 034; Shreepad Panth; et al. (ISSCC, 2012)

Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory). - Daehyun Kim 004; Krit Athikulwongse; Michael B. Healy; Mohammad M. Hossain; Moongon Jung; Ilya Khorosh; Gokul Kumar; Young-Joon Lee; Dean L. Lewis; Tzu-Wei Lin; Chang Liu 034; Shreepad Panth; et al. (IEEE Trans. Computers, 2015)