Mechanism and thermal effect of delamination in light-emitting diode packages. - Jianzheng Hu; Lianqiao Yang; Moo Whan Shin (Microelectron. J., 2007)

Thermal investigation of LED lighting module. - Jong Hwa Choi; Moo Whan Shin (Microelectron. Reliab., 2012)

Reliability of high-power LED packaging and assembly. - Cheng-Yi Liu; S. W. Ricky Lee; Moo Whan Shin; Yi-Shao Lai (Microelectron. Reliab., 2012)