Development of Functionally innovative 3D-Integrated Circuit (Dream Chip) technology / High-Density 3D-Integration Technology for Multifunctional Devices. - Morihiro Kada (3DIC, 2009)

Combination between the nonlinear finite element analyses and the strain measurement using the digital image correlation for a new 3D SIC package. - Toru Ikeda; Masatoshi Oka; Shinya Kawahara; Noriyuki Miyazaki; Keiji Matsumoto; Sayuri Kohara; Yasumitsu Orii; Fumiaki Yamada; Morihiro Kada (3DIC, 2011)