Automatic opitcal through hole inspection method for printed wiring boards using leakage light detection. - Moritoshi Ando; Kikuo Mita; Takefumi Inagaki (ICRA, 1985)

Automatic optical inspection of plated through-holes for ultrahigh density printed wiring boards. - Moritoshi Ando; Takefumi Inagaki (Mach. Vis. Appl., 1988)

Automated verification technology using CAD data. - Moritoshi Ando; Hiroshi Oka; Hideo Okada; Yorihiro Sakashita; Nobumi Shibutani (Syst. Comput. Jpn., 1999)

High-speed solder bump inspection system using a laser scanner and CCD camera. - Hiroyuki Tsukahara; Yoji Nishiyama; Fumiyuki Takahashi; Takashi Fuse; Toru Nishino; Moritoshi Ando (Syst. Comput. Jpn., 2000)

Lipreading method using color extraction method and eigenspace technique. - Yasuyuki Nakata; Moritoshi Ando (Syst. Comput. Jpn., 2004)