Sales-force performance analytics and optimization. - Moritz Baier; Jorge E. Carballo; Alice J. Chang; Yingdong Lu; Aleksandra Mojsilovic; M. Jonathan Richard; Moninder Singh; Mark S. Squillante; Kush R. Varshney (IBM J. Res. Dev., 2012)

Silicon-organic hybrid (SOH) modulator generating up to 84 Gbit/s BPSK and M-ASK signals. - Robert Palmer; Luca Alloatti; Dietmar Korn; Philipp C. Schindler; René Schmogrow; Moritz Baier; Swen Koenig; David Hillerkuss; Jens Bolten; Thorsten Wahlbrink; Michael Waldow; Raluca Dinu; et al. (OFC/NFOEC, 2013)

100-Channel WDM Rx-type PIC on InP for use of low-cost and low power consumption electronics. - Moritz Baier; R. Broeke; Francisco M. Soares; Marko Gruner; Angela Seeger; Martin Moehrle; Norbert Grote; Martin Schell (ECOC, 2014)

112 Gb/s PDM-PAM4 Generation and 80 km Transmission Using a Novel Monolithically Integrated Dual-Polarization Electro-Absorption Modulator InP PIC. - Moritz Baier; Francisco M. Soares; Zhennan Zheng; Carsten Schmidt-Langhorst; Robert Elschner; Felix Frey; Marko Gruner; Johannes Karl Fischer; Colja Schubert; Martin Moehrle; Norbert Grote; Martin Schell (ECOC, 2017)

New Polarization Multiplexed Externally Modulated Laser PIC. - Moritz Baier; Francisco M. Soares; Tom Gaertner; A. Schoenau; Martin Möhrle; Martin Schell (ECOC, 2018)

High-Performance InP PIC Technology Development based on a Generic Photonic Integration Foundry. - Francisco M. Soares; Moritz Baier; Tom Gaertner; Mike Feyer; Martin Moehrle; Norbert Grote; Martin Schell (OFC, 2018)

Fully Integrated Stokes Vector Receiver for 400 Gbit/s. - Moritz Baier; Francisco M. Soares; Axel Schoenau; Y. Durvasa Gupta; David Melzer; Martin Moehrle; Martin Schell (OFC, 2019)

Hybrid Polymer THz Receiver PIC with Waveguide Integrated Photoconductive Antenna: Concept and 1st Characterization Results. - Tianwen Qian; Milan Deumer; Y. Durvasa Gupta; Simon Nellen; Ben Schuler; Hauke Conradi; Martin Kresse; Jakob Reck; Klara Mihov; Moritz Kleinert; Madeleine Weigel; Crispin Zawadzki; et al. (OFC, 2022)

Deep Learning-based Multi Project InP Wafer Simulation for Unsupervised Surface Defect Detection. - Emílio Dolgener Cantú; Rolf Klemens Wittmann; Oliver Abdeen; Patrick Wagner 002; Wojciech Samek; Moritz Baier; Sebastian Lapuschkin (CoRR, 2025)