A study of large area die bonding materials and their corresponding mechanical and thermal properties. - Te-yuan Chung; Jian-Hong Jhang; Jing-Sian Chen; Yi-Chien Lo; Gwo-Herng Ho; Mount-Learn Wu; Ching-Cherng Sun (Microelectron. Reliab., 2012)

Polymer-based vertically optical splitter with 20-Gbps transmission rate realized on silicon substrate. - Chin-Ta Chen; Po-Kuan Shen; Chia-Chi Chang; Hsu-Liang Hsiao; Tien-Yu Huan; Teng-Zhang Zhu; Hsiao-Chin Lan; Yun-Chih Lee; Yo-Shen Lin; Mount-Learn Wu (OFC/NFOEC, 2013)

Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate. - Chin-Ta Chen; Po-Kuan Shen; Teng-Zhang Zhu; Chia-Chi Chang; Shu-Shuan Lin; Mao-Yuan Zeng; Chien-Yu Chiu; Hsu-Liang Hsiao; Hsiao-Chin Lan; Yun-Chih Lee; Yo-Shen Lin; Mount-Learn Wu (OFC, 2014)

On-chip optical interconnects integrated with laser and photodetector using three-dimensional silicon waveguides. - Po-Kuan Shen; Chin-Ta Chen; Chia-Hao Chang; Chien-Yu Chiu; Chia-Chi Chang; Hsiao-Chin Lan; Yun-Chih Lee; Mount-Learn Wu (OFC, 2014)