Thermal fatigue effects on the temperature distribution inside IGBT modules for zone engine aeronautical applications. - T. Lhommeau; Xavier Perpiñà; C. Martin; Régis Meuret; Michel Mermet-Guyennet; Moussa Karama (Microelectron. Reliab., 2007)

Reliability of lead-free solder in power module with stochastic uncertainty. - Alexandre Micol; Carmen Martin; Olivier Dalverny; Michel Mermet-Guyennet; Moussa Karama (Microelectron. Reliab., 2009)

An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications. - Alexandre Micol; A. Zeanh; T. Lhommeau; Stephane Azzopardi; Eric Woirgard; Olivier Dalverny; Moussa Karama (Microelectron. Reliab., 2009)

Experimental characterization of the mechanical behavior of two solder alloys for high temperature power electronics applications. - Sabeur Msolli; Joël Alexis; Olivier Dalverny; Moussa Karama (Microelectron. Reliab., 2015)