Fabrication and thermal analysis of flip-chip light-emitting diodes with different numbers of Au stub bumps. - Cheng-Chen Lin; Liann-Be Chang; Ming-Jer Jeng; Chia-Yi Yen; Atanu Das; Chung-Yi Tang; Ming-Yi Tsai; Mu-Jen Lai (Microelectron. Reliab., 2010)

Inserting a low-temperature n-GaN underlying layer to separate nonradiative recombination centers improves the luminescence efficiency of blue InGaN/GaN LEDs. - Ray-Ming Lin; Yung-Hsiang Lin; Chung-Hao Chiang; Mu-Jen Lai; Yi-Lun Chou; Yuan-Chieh Lu; Shou-Yi Kuo; Bor-Ren Fang; Meng-Chyi Wu (Microelectron. Reliab., 2010)

Heat sink performances of GaN/InGaN flip-chip light-emitting diodes fabricated on silicon and AlN submounts. - Ming-Jer Jeng; Kuo-Ling Chiang; Hsin-Yi Chang; Chia-Yi Yen; Cheng-Chen Lin; Yuan-Hsiao Chang; Mu-Jen Lai; Yu-Lin Lee; Liann-Be Chang (Microelectron. Reliab., 2012)

Epoxy Molding Compound Lead Frames With Silicone Resin for Encapsulating AlGaN-Based UVB Light-Emitting Diodes. - Tsung-Yen Liu; Shih-Ming Huang; Mu-Jen Lai; Rui-Sen Liu; Yi-Tsung Chang; Wen-Hong Sun; Ray-Ming Lin (IEEE Access, 2021)