Vernier ring based pre-bond through silicon vias test in 3D ICs. - Tianming Ni; Mu Nie; Huaguo Liang; Jingchang Bian; Xiumin Xu; Xiangsheng Fang; Zhengfeng Huang; Xiaoqing Wen (IEICE Electron. Express, 2017)

A Region-Based Through-Silicon via Repair Method for Clustered Faults. - Tianming Ni; Huaguo Liang; Mu Nie; Xiumin Xu; Aibin Yan; Zhengfeng Huang (IEICE Trans. Electron., 2017)

TransPose: Towards Explainable Human Pose Estimation by Transformer. - Sen Yang; Zhibin Quan; Mu Nie; Wankou Yang (CoRR, 2020)

TransPose: Keypoint Localization via Transformer. - Sen Yang; Zhibin Quan; Mu Nie; Wankou Yang (ICCV, 2021)

Broadcast-TDMA: A Cost-Effective Fault-Tolerance Method for TSV Lifetime Reliability Enhancement. - Tianming Ni; Jingchang Bian; Zhao Yang; Mu Nie; Liang Yao; Zhengfeng Huang; Aibin Yan; Xiaoqing Wen (IEEE Des. Test, 2022)

Enhancing Defect Diagnosis and Localization in Wafer Map Testing Through Weakly Supervised Learning. - Mu Nie; Wen Jiang; Wankou Yang; Senling Wang; Xiaoqing Wen; Tianming Ni (ATS, 2023)

Enhancing motion visual cues for self-supervised video representation learning. - Mu Nie; Zhibin Quan; Weiping Ding 001; Wankou Yang (Eng. Appl. Artif. Intell., 2023)

Multi-receptive field spatiotemporal network for action recognition. - Mu Nie; Sen Yang; Zhenhua Wang; Baochang Zhang 001; Huimin Lu 001; Wankou Yang (Int. J. Mach. Learn. Cybern., 2023)

A demultiplexer-based dual-path switching true random number generator. - Tianming Ni; Kejie Xu; Hao Wu; Senling Wang; Mu Nie (Microelectron. J., 2024)

Efficient Modulated State Space Model for Mixed-Type Wafer Defect Pattern Recognition. - Mu Nie; Shidong Zhu; Aibin Yan; Cheng Zhuo; Xiaoqing Wen; Tianming Ni (DATE, 2025)

A lightweight general PUF framework for resisting machine learning attacks. - Tianming Ni; Fei Li; Zhengfeng Huang; Aibin Yan; Senling Wang; Xiaoqing Wen; Mu Nie; Jingchang Bian (Integr., 2025)

Segmentation-Enhanced Overlapped Defect Identification for Multipatterns Wafer Maps. - Tianming Ni; Wen Jiang; Huaguo Liang; Xiaoqing Wen; Mu Nie (IEEE Trans. Instrum. Meas., 2025)