Characterization and fatigue damage simulation in SAC solder joints. - Müge Erinc; Piet J. G. Schreurs; G. Q. Zhang; Marc G. D. Geers (Microelectron. Reliab., 2004)

A multi-scale approach of the thermo-mechanical properties of silica-filled epoxies used in electronic packaging. - E. R. Weltevreden; S. J. Tesarski; Artur Wymyslowski; Müge Erinc; Alexander W. J. Gielen (Microelectron. Reliab., 2012)