Impact of thermal aging on the intermetallic compound particle size and mechanical properties of lead free solder for green electronics. - Muhammad Aamir 006; Riaz Muhammad 005; Naseer Ahmed; Muhammad Waqas 001 (Microelectron. Reliab., 2017)

Security in Fog Computing: A Novel Technique to Tackle an Impersonation Attack. - Shan-Shan Tu; Muhammad Waqas 001; Sadaqat ur Rehman; Muhammad Aamir 006; Obaid Ur Rehman 003; Jianbiao Zhang; Chinchen Chang 001 (IEEE Access, 2018)

The Allocation and Reuse Scheme of Physical Cell Identifications Based on Maximum Degree First Coloring Algorithm. - Meng Liu 004; Shanshan Tu; Chuangbai Xiao; Muhammad Waqas 001; Sadaqat ur Rehman; Muhammad Aamir 006; Chin-Chen Chang 001 (IEEE Syst. J., 2020)

Measurement of Micro Burr and Slot Widths through Image Processing: Comparison of Manual and Automated Measurements in Micro-Milling. - Fatih Akkoyun; Ali Ercetin; Kubilay Aslantas; Danil Yurievich Pimenov; Khaled Giasin; Avinash Lakshmikanthan; Muhammad Aamir 006 (Sensors, 2021)