Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips. - Tobias Hoose; Muhammad Rodlin Billah; Matthias Blaicher; Pablo Marin; Philipp-Immanuel Dietrich; Andreas Hofmann; Ute Troppenz; Martin Möhrle; Nicole Lindenmann; M. Thiel; P. Simon; Jörg Hoffmann; et al. (OFC, 2016)

Four-Channel 784 Gbit/s Transmitter Module Enabled by Photonic Wire Bonding and Silicon-Organic Hybrid Modulators. - Muhammad Rodlin Billah; Juned N. Kemal; Pablo Marin-Palomo; Matthias Blaicher; Yasar Kutuvantavida; Clemens Kieninger; Heiner Zwickel; Philipp-Immanuel Dietrich; Stefan Wolf 004; Tobias Hoose; Yilin Xu; Ute Troppenz; et al. (ECOC, 2017)

8-Channel 448 Gbit/s silicon photonic transmitter enabled by photonic wire bonding. - Muhammad Rodlin Billah; Matthias Blaicher; Juned N. Kemal; Tobias Hoose; Heiner Zwickel; Philipp-Immanuel Dietrich; Ute Troppenz; Martin Möhrle; Florian Merget; A. Hofmann; Jeremy Witzens; Sebastian Randel; et al. (OFC, 2017)

Hardwired Configurable Photonic Integrated Circuits Enabled by 3D Nanoprinting. - Tobias Hoose; Matthias Blaicher; Juned N. Kemal; Heiner Zwickel; Muhammad Rodlin Billah; Philipp-Immanuel Dietrich; A. Hofmann; Wolfgang Freude; Sebastian Randel; Christian Koos (ECOC, 2018)

Photonic Wire Bonding and 3D Nanoprinting in Photonic Integration - from Lab Demonstrations to Production. - Christian Koos; Wolfgang Freude; Sebastian Randel; Muhammad Rodlin Billah; Matthias Blaicher; Philipp-Immanuel Dietrich; Tobias Hoose; Yilin Xu; Juned N. Kemal; Aleksandar Nesic; Andreas Hofmann (ECOC, 2018)

3D-Printed Optics for Wafer-Scale Probing. - Mareike Trappen; Matthias Blaicher; Philipp-Immanuel Dietrich; Tobias Hoose; Yilin Xu; Muhammad Rodlin Billah; Wolfgang Freude; Christian Koos (ECOC, 2018)

Efficient Coupling Interfaces in Photonic Systems Enabled by Printed Freeform Micro-Optics. - Christian Koos; Wolfgang Freude; Sebastian Randel; Philipp-Immanuel Dietrich; Matthias Blaicher; Yilin Xu; Muhammad Rodlin Billah; Tobias Hoose; Mareike Trappen; A. Hofmann (ICTON, 2018)

InP/Silicon Hybrid External-Cavity Lasers (ECL) using Photonic Wirebonds as Coupling Elements. - Yilin Xu; Pascal Maier; Matthias Blaicher; Philipp-Immanuel Dietrich; Pablo Marin-Palomo; Wladislaw Hartmann; Muhammad Rodlin Billah; Ute Troppenz; Martin Möhrle; Sebastian Randel; Wolfgang Freude; Christian Koos (OFC, 2020)