Wafer-level vacuum packaging for hetero-integration by thermo-compression bonding using planarized-electroplated gold bumps. - Muhammad Salman Al Farisi; Hideki Hirano; Shuji Tanaka (NEMS, 2016)

Dual-Mass Resonator with Dynamically Balanced Structure for Roll/Pitch Rate Integrating Gyroscope. - Shihe Wang; Muhammad Salman Al Farisi; Jianlin Chen; Takashiro Tsukamoto; Shuji Tanaka (IEEE SENSORS, 2021)

Single-Step Laser Fabrication of 3D Free-Standing Origami MEMS Thermal Sensor. - Mohammad Nizar Mohamed Zukri; Muhammad Salman Al Farisi; Yoshihiro Hasegawa; Mitsuhiro Shikida (IEEE SENSORS, 2024)