Au-NiW Mechanically Flexible Interconnects (MFIs) and TSV integration for 3D interconnects. - Chaoqi Zhang 001; Paragkumar Thadesar; Muneeb Zia; Thomas E. Sarvey; Muhannad S. Bakir (3DIC, 2014)

Fabrication of and cell growth on 'silicon membranes' with high density TSVs for bio-sensing applications. - Muneeb Zia; Chaoqi Zhang 001; Paragkumar Thadesar; Tracy Hookway; Taiyun Chi; Joe L. Gonzalez; Todd C. McDevitt; Hua Wang 006; Muhannad S. Bakir (BioCAS, 2015)

A Memory-Based Logic Block With Optimized-for-Read SRAM for Energy-Efficient Reconfigurable Computing Fabric. - Wen Yueh; Subho Chatterjee; Muneeb Zia; Swarup Bhunia; Saibal Mukhopadhyay (IEEE Trans. Circuits Syst. II Express Briefs, 2015)

Chip-to-chip interconnect integration technologies. - Muneeb Zia; Chaoqi Zhang 001; Hyun Suk Yang; Li Zheng; Muhannad S. Bakir (IEICE Electron. Express, 2016)

Microfabrication, assembly, and hermetic packaging of mm-sized free-floating neural probes. - Pyungwoo Yeon; Joe L. Gonzalez; Muneeb Zia; Sreejith Kochupurackal Rajan; Gary S. May; Muhannad S. Bakir; Maysam Ghovanloo (BioCAS, 2017)

High-performance Flexible Microelectrode Array with PEDOT: PSS Coated 3D Micro-cones for Electromyographic Recording. - Jiaao Lu; Muneeb Zia; Matthew J. Williams; Amanda L. Jacob; Bryce Chung; Samuel J. Sober; Muhannad S. Bakir (EMBC, 2022)