Fabrication and bonding process of fine pitch Cu pillar bump on thin Si chip for 3D stacking IC. - Won-Myoung Ki; Myong-Suk Kang; Sehoon Yoo; Chang-Woo Lee (3DIC, 2011)

Advanced TSV filling method with Sn alloy and its reliability. - Young-Ki Ko; Myong-Suk Kang; Hiroyuki Kokawa; Yutaka S. Sato; Sehoon Yoo; Chang-Woo Lee (3DIC, 2011)