Reliability on EUV Interconnect Technology for 7nm and beyond. - Tae-Young Jeong; Miji Lee; Yunkyung Jo; Jinwoo Kim; Min Kim; Myungsoo Yeo; Jinseok Kim 005; Hyunjun Choi; Joosung Kim; Yoojin Jo; Yongsung Ji; Taiki Uemura; et al. (IRPS, 2020)

Polarity Dependence and Metal Density Impact on Multi-Layer Inter-Level TDDB for High Voltage Application. - Yinghong Zhao; Ki-Don Lee; Manisha Sharma; Joonah Yoon; Rakesh Ranjan; Md Iqbal Mahmud; Caleb Dongkyan Kwon; Myungsoo Yeo (IRPS, 2022)

Polarity Dependency of MOL-TDDB in FinFET. - Manisha Sharma; Hokyung Park; Yinghong Zhao; Ki-Don Lee; Liangshan Chen; Joonah Yoon; Rakesh Ranjan; Caleb Dongkyan Kwon; Hyewon Shim; Myungsoo Yeo; Shin-Young Chung; Jon Haefner (IRPS, 2023)

Impacts of Post-Cu CMP Queue Time on Reliability. - Yinghong Zhao; Hokyung Park; Ki-Don Lee; Liangshan Chen; Manisha Sharma; Sugento Huandra; Hanson Mao; Brian Filemyr Smith; Wei Xia; Joonah Yoon; Junehwan Kim; Myungsoo Yeo; et al. (IRPS, 2024)

The Impact of Silicon Concentration on the Reliability of Tungsten Silicide. - Liangshan Chen; Yinghong Zhao; Ki-Don Lee; Manisha Sharma; Joonah Yoon; Timothy Davis; Kayla N. Sanders; Myungsoo Yeo; Amado Longoria; Shou-Liang Zhang; Ju Kwang Kim; Dung Dau; et al. (IRPS, 2025)

Reliability Impacts of Tapered Nanosheets and Localized Layout Effects in MBCFETs Fabricated with 2NM Logic Technology Featuring GAA. - Seongkyung Kim; Eunyu Choi; Jinyoung Kim; Junkyo Jeong; Jihun Ryu; Myungsoo Yeo; Taiki Uemura; Shin-Young Chung; Jong-Ho Lee (IRPS, 2025)

Introduction to Voltage-Ramping Wafer Level Electromigration Method and Current Exponent Correction Factor for Co-Capping Metal Lines. - Da Yong Shin; Hyunjun Choi; Joosung Kim; Myungsoo Yeo; Miji Lee; Taiki Uemura; Shin-Young Chung; Jong-Ho Lee (IRPS, 2025)