Lift-out techniques coupled with advanced TEM characterization methods for electrical failure analysis. - N. Bicaïs-Lépinay; F. André; R. Pantel; S. Jullian; Alain Margain; L. F. Tz. Kwakman (Microelectron. Reliab., 2002)

Electron BackScattered Diffraction (EBSD) use and applications in newest technologies development. - S. Courtas; M. Grégoire; X. Federspiel; N. Bicaïs-Lépinay; C. Wyon (Microelectron. Reliab., 2006)