Impact of oxide liner properties on TSV Cu pumping and TSV stress. - Joke De Messemaeker; O. Varela Pedreira; A. Moussa; Nabi Nabiollahi; Kris Vanstreels; Stefaan Van Huylenbroeck; Harold Philipsen; Patrick Verdonck; Bart Vandevelde; Ingrid De Wolf; Eric Beyne; Kris Croes (IRPS, 2015)

Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling. - Nabi Nabiollahi; Nele Moelans; Mario Gonzalez; Joke De Messemaeker; Christopher J. Wilson; Kristof Croes; Eric Beyne; Ingrid De Wolf (Microelectron. Reliab., 2015)