Comparative Study of TDDB Models on BEOL Interconnects for Sub-20 nm Spacings. - Niaz Mahmud; Nabihah Azhari; J. R. Lloyd (IRPS, 2019)

Stress Migration Followed by Electromigration Reliability Testing. - J. M. Passage; Nabihah Azhari; J. R. Lloyd (IRPS, 2019)