Evolving More Testable Digital Combinational Circuits. - Nahid Mirzaie; Seyyed Javad Seyyed Mahdavi; Karim Mohammadi (CDES, 2010)

High-performance RF-interconnect for 3D stacked memory. - Ahmed Alzahmi; Nahid Mirzaie; Chung-Ching Lin; Insoo Kim; Gyung-Su Byun (ISOCC, 2017)

A low-power and performance-efficient SAR ADC design. - Nahid Mirzaie; Ahmed Alzahmi; Chung-Ching Lin; Insoo Kim; Gyung-Su Byun (ISOCC, 2017)

Low-power and high-performance 2.4 GHz RF transmitter for biomedical application. - Ahmed Alzahmi; Nahid Mirzaie; Chung-Ching Lin; Gyung-Su Byun (UEMCON, 2017)

A performance-aware I/O interface for 3D stacked memory systems. - Nahid Mirzaie; Ahmed Alzahmi; Chung-Ching Lin; Gyung-Su Byun (UEMCON, 2017)

Yield-aware sizing of pipeline ADC using a multiple-objective evolutionary algorithm. - Nahid Mirzaie; Hossein Shamsi; Gyung-Su Byun (Int. J. Circuit Theory Appl., 2017)

Automatic Design and Yield Enhancement of Data Converters. - Nahid Mirzaie; Hossein Shamsi; Gyung-Su Byun (J. Circuits Syst. Comput., 2017)

A 3D flash ADC structure for high-speed communication applications. - Nahid Mirzaie; Ahmed Alzahmi; Chung-Ching Lin; Gyung-Su Byun (CCWC, 2018)

Design of a Pre-Distortion Power Amplifier for Ku-Band/5G Applications. - Chung-Ching Lin; Ahmed Alzahmi; Nahid Mirzaie; Gyung-Su Byun (EIT, 2018)

Three-Dimensional Pipeline ADC Utilizing TSV/ Design Optimization and Memristor Ratioed Logic. - Nahid Mirzaie; Ahmed Alzahmi; Hossein Shamsi; Gyung-Su Byun (IEEE Trans. Very Large Scale Integr. Syst., 2018)

A Macromodeling Approach for Analog Behavior of Digital Integrated Circuits. - Nahid Mirzaie; Ron Rohrer (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2020)

3D IC Packaging Utilizing a Metal Structure for Heat Reduction, Noise Shielding, and High Interconnect Density. - Nahid Mirzaie; Ron Rohrer (ISQED, 2021)