First Heterogeneous and Monolithic 3D (HM3D) Integration of InGaAs HEMTs and InP/InGaAs DHBTs on Si CMOS for Next-Generation Wireless Communication. - Nahyun Rheem; Jaeyong Jeong; Yoon-Je Suh; Chan Jik Lee; Bong Ho Kim; Joon Pyo Kim; Seong Kwang Kim; Hyeongrak Lim; Jongmin Kim; Dae-Hwan Ahn; Jae-Hoon Han; Jongwon Lee; et al. (VLSI Technology and Circuits, 2024)