Physical-Aware Interconnect Test for Multi-Die Systems Using 3Dblox Open Standard. - Sandeep Kumar Goel; Ankita Patidar; Moiz Khan; Frank Lee 004; Anshuman Chandra; Martin Keim; Naim Lemar; Jonathan Gaudet; Quoc Phan; Vidya Neerkundar (ITC, 2024)