Electromigration Early Failures for Cu Pillar Interconnections with an ENEPIG Pad Finish and its Suppression. - Hideaki Tsuchiya; Naohito Suzumura; Ryuji Shibata; Hideki Aono; Makoto Ogasawara; Toshihiko Akiba; Kenji Sakata; Kazuyuki Nakagawa; Takuo Funaya (IRPS, 2019)

Impact of Anode-side Defect Generation on Inter-Level TDDB Degradation in Cu/Low-k Damascene Structures. - Naohito Suzumura; Kazuyuki Omori; Hideaki Tsuchiya; Hideki Aono; Tomohiro Yamashita (IRPS, 2020)