IQ Modulators with Two Segments using InP/SOI Chip-on-Wafer Bonding Process for Optical DAC. - Hajime Tanaka 002; Naotaka Kasuya; Taichi Misawa; Yohei Sobu; Shuntaro Maeda; Kento Komatsu; Naoko Inoue; Takehiko Kikuchi; Takuya Mitarai; Shun Kimura; Naoki Fujiwara; Nobuhiko Nishiyama; et al. (OFC, 2026)