Mechanical Stress Effects on Dielectric Leakage and Interconnection Integrity in 3D NAND Flash Memory. - Sehoon Lee; Jieun Lee; Sungpil Jang; Sujeong Kim; Choelgyu Kim; Narae Jeong Sae-Jin Kim; Jisoo Kang; Juhee Hong; Dong-Kyu Kim; Junhee Lim; Sejun Park; Seungwan Hong; et al. (VLSI Technology and Circuits, 2024)