Wafer-level 3D integration technology. - Steven J. Koester; Albert M. Young; Roy R. Yu; Sampath Purushothaman; Kuan-Neng Chen; Douglas C. La Tulipe Jr.; Narender Rana; Leathen Shi; Matthew R. Wordeman; Edmund J. Sprogis (IBM J. Res. Dev., 2008)

Controlling Interfacial Adhesion of Self-Assembled Polypeptide Fibrils for Novel Nanoelectromechanical System (NEMS) Applications. - Narender Rana; Christopher Kossow; Eric T. Eisenbraun; Robert E. Geer; Alain E. Kaloyeros (Micromachines, 2011)