Thermal analysis for a SiGe HBT 40 watt 32 GHz clock 3D memory processor chip stack using diamond heat spreader layers. - John F. McDonald 001; Okan Erdogan; Philip Jacob 001; Paul M. Belemjian; Alexey Gutin; Aamir Zia; Michael Chu; Jin Woo Kim; Ryan Clarke; Nate DeSimone; Sherry Liu; Russell P. Kraft (3DIC, 2009)