Through-Silicon Via (TSV)-induced noise characterization and noise mitigation using coaxial TSVs. - Nauman H. Khan; Syed M. Alam; Soha Hassoun (3DIC, 2009)

System-level comparison of power delivery design for 2D and 3D ICs. - Nauman H. Khan; Syed M. Alam; Soha Hassoun (3DIC, 2009)

Early estimation of TSV area for power delivery in 3-D integrated circuits. - Nauman H. Khan; Sherief Reda; Soha Hassoun (3DIC, 2010)

Mitigating TSV-induced substrate noise in 3-D ICs using GND plugs. - Nauman H. Khan; Syed M. Alam; Soha Hassoun (ISQED, 2011)

Power Delivery Design for 3-D ICs Using Different Through-Silicon Via (TSV) Technologies. - Nauman H. Khan; Syed M. Alam; Soha Hassoun (IEEE Trans. Very Large Scale Integr. Syst., 2011)

The feasibility of Carbon Nanotubes for power delivery in 3-D Integrated Circuits. - Nauman H. Khan; Soha Hassoun (ASP-DAC, 2012)

Designing TSVs for 3D Integrated Circuits - Nauman H. Khan; Soha Hassoun (Springer, 2013)

A Low-Cost IoT Based System for Environmental Monitoring. - Nauman H. Khan; Khurram S. Khattak; Shaukat Ullah; Zawar H. Khan (FIT, 2019)