Monolithic 3D integration of SRAM and image sensor using two layers of single grain silicon. - Negin Golshani; Jaber Derakhshandeh; Ryoichi Ishihara; C. I. M. Beenakker; Michael Robertson; Thomas Morrison (3DIC, 2010)

High-ohmic resistors using nanometer-thin pure-boron chemical-vapour-deposited layers. - Negin Golshani; Vahid Mohammadi; Siva Ramesh; Lis K. Nanver (ESSDERC, 2013)

Single-Grain Si Thin-Film Transistors for Monolithic 3D-ICs and Flexible Electronics. - Ryoichi Ishihara; Jin Zhang; Miki Trifunovic; Jaber Derakhshandeh; Negin Golshani; Daniel M. R. Tajari Mofrad; Tao Chen; Kees Beenakker; Tatsuya Shimoda (IEICE Trans. Electron., 2014)

Silicon Photonics for 56G NRZ Optical Interconnects. - Joris Van Campenhout; Yoojin Ban; Peter De Heyn; Ashwyn Srinivasan; Jeroen De Coster; Sebastien Lardenois; Brad Snyder; Sadhishkumar Balakrishnan; Guy Lepage; Negin Golshani; Sofie Janssen; Alicja Lesniewska; et al. (OFC, 2018)

Sub-1 dB Loss SiN-to-Polymer Waveguide Coupling: an Enabler for Co-Packaged Optics. - Jef Van Asch; Jeroen Missinne; Junwen He; Pengfei Xu; Arnita Podpod; Guy Lepage; Negin Golshani; Rafal Magdziak; Huseyin Sar; Hakim Kobbi; Swetanshu Bipul; Dieter Bode; et al. (OFC, 2024)

Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer. - Pengfei Xu; Junwen He; Koen Kennes; Anton Dvoretskii; Arnita Podpod; Guy Lepage; Negin Golshani; Rafal Magdziak; Swetanshu Bipul; Dieter Bode; Peter Verheyen; Maumita Chakrabarti; et al. (OFC, 2024)

Low-loss, multi-reticle stitched SiN waveguides for 300mm wafer-level optical interconnects. - Pengfei Xu; Chiara Marchese; Guy Lepage; Negin Golshani; Ruben Van Eenaeme; Andrea Mingardi; Joost Van Ongeval; Rafal Magdziak; Luc Halipre; Darko Trivkovic; Peter Verheyen; Maumita Chakrabarti; et al. (OFC, 2024)