Fast and simple method for calculating the minority-carrier current in arbitrarily doped semiconductors. - Niccolò F. Rinaldi (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 1996)

Analytical Solutions of the Diffusive Heat Equation as the Application for Multi-cellular Device Modeling - A Numerical Aspect. - Zbigniew Lisik; Janusz Wozny; Malgorzata Langer; Niccolò Rinaldi (International Conference on Computational Science, 2004)

Avalanche multiplication and pinch-in models for simulating electrical instability effects in SiGe HBTs. - Grazia Sasso; Maurizio Costagliola; Niccolò Rinaldi (Microelectron. Reliab., 2010)

An Experimental Power-Lines Model for Digital ASICs Based on Transmission Lines. - Maurizio Costagliola; Davide De Caro; Antonio Girardi; Roberto Izzi; Niccolò Rinaldi; Marco Spirito; Paolo Spirito (IEEE Trans. Very Large Scale Integr. Syst., 2012)

Dynamic electrothermal macromodeling techniques for thermal-aware design of circuits and systems. - Alessandro Magnani; Vincenzo d'Alessandro; Niccolò Rinaldi; Massimiliano de Magistris; Klaus Aufinger (PATMOS, 2013)

Evaluation of thermal balancing techniques in InGaP/GaAs HBT power arrays for wireless handset power amplifiers. - Andre G. Metzger; Vincenzo d'Alessandro; Niccolò Rinaldi; Peter J. Zampardi (Microelectron. Reliab., 2013)

Analysis of the UIS behavior of power devices by means of SPICE-based electrothermal simulations. - Vincenzo d'Alessandro; Alessandro Magnani; Michele Riccio; Yohei Iwahashi; Giovanni Breglio; Niccolò Rinaldi; Andrea Irace (Microelectron. Reliab., 2013)

Structure-preserving approach to multi-port dynamic compact models of nonlinear heat conduction. - Lorenzo Codecasa; Vincenzo d'Alessandro; Alessandro Magnani; Niccolò Rinaldi (Microelectron. J., 2015)

Reliability of high-speed SiGe: C HBT under electrical stress close to the SOA limit. - Thomas Jacquet; Grazia Sasso; Anjan Chakravorty; Niccolò Rinaldi; Klaus Aufinger; Thomas Zimmer; Vincenzo d'Alessandro; Cristell Maneux (Microelectron. Reliab., 2015)

Advanced thermal simulation of SiGe: C HBTs including back-end-of-line. - Vincenzo d'Alessandro; Alessandro Magnani; Lorenzo Codecasa; Niccolò Rinaldi; Klaus Aufinger (Microelectron. Reliab., 2016)

3-D thermal models calibration by parametric dynamic compact thermal models. - Lorenzo Codecasa; Vincenzo d'Alessandro; Alessandro Magnani; Niccolò Rinaldi (Microelectron. Reliab., 2017)

Partition-based approach to parametric dynamic compact thermal modeling. - Lorenzo Codecasa; Vincenzo d'Alessandro; Alessandro Magnani; Niccolò Rinaldi; Andre G. Metzger; Robin Bornoff; John Parry (Microelectron. Reliab., 2017)

Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies. - Vincenzo d'Alessandro; Antonio Pio Catalano; Alessandro Magnani; Lorenzo Codecasa; Niccolò Rinaldi; Brian Moser; Peter J. Zampardi (Microelectron. Reliab., 2017)

Si/SiGe: C and InP/GaAsSb Heterojunction Bipolar Transistors for THz Applications. - Pascal Chevalier 002; Michael Schröter; Colombo R. Bolognesi; Vincenzo d'Alessandro; Maria Alexandrova; Josef Böck; Ralf Flickiger; Sébastien Fregonese; Bernd Heinemann; Christoph Jungemann; Rickard Lovblom; Cristell Maneux; et al. (Proc. IEEE, 2017)

Versatile MOR-based boundary condition independent compact thermal models with multiple heat sources. - Lorenzo Codecasa; Robin Bornoff; James Dyson; Vincenzo d'Alessandro; Alessandro Magnani; Niccolò Rinaldi (Microelectron. Reliab., 2018)

Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization. - Brice Rogié; Lorenzo Codecasa; Eric Monier-Vinard; Valentin Bissuel; Najib Laraqi; Olivier Daniel; Dario D'Amore; Alessandro Magnani; Vincenzo d'Alessandro; Niccolò Rinaldi (Microelectron. Reliab., 2018)