Chip Power-Frequency Scaling in 10/7nm Node. - Phil Oldiges; Reinaldo A. Vega; Henry K. Utomo; Nick A. Lanzillo; Thomas Wassick; Juntao Li; Junli Wang; Ghavam G. Shahidi (IEEE Access, 2020)

Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects. - Takeshi Nogami; Oleg Gluschenkov; Yasir Sulehria; Son Nguyen; Brown Peethala; Huai Huang; Hosadurga Shobha; Nick A. Lanzillo; Raghuveer Patlolla; Devika Sil; Andrew Simon; Daniel Edelstein; et al. (VLSI Technology and Circuits, 2022)

Power Delivery Design, Signal Routing, and Performance of On-Chip Cobalt Interconnects in Advanced Technology Nodes. - Nicholas A. Lanzillo; Albert Chu; Prasad Bhosale; Dan J. Dechene (IEEE Trans. Very Large Scale Integr. Syst., 2022)

Backside Power Distribution for Nanosheet Technologies Beyond 2nm. - Ruilong Xie; Wonhyuk Hong; Chen Zhang; Jongjin Lee; Kevin Brew; Richard Johnson; Nicholas A. Lanzillo; Hosadurga Shobha; Taesun Kim; Panjae Park; Shogo Mochizuki; Iqbal Saraf; et al. (VLSI Technology and Circuits, 2024)