ITAC: A complete 3D integration test platform. - Didier Lattard; Lucile Arnaud; Arnaud Garnier; Nicolas Bresson; Franck Bana; R. Segaud; Amadine Jouve; H. Jacquinot; Stéphane Moreau; Karim Azizi-Mourier; C. Chantre; Pascal Vivet; et al. (3DIC, 2016)

Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability. - Lucile Arnaud; Stéphane Moreau; Amadine Jouve; Imed Jani; Didier Lattard; F. Fournel; C. Euvrard; Y. Exbrayat; Viorel Balan; Nicolas Bresson; S. Lhostis; J. Jourdon; et al. (IRPS, 2018)

Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development. - Emilie Bourjot; Paul Stewart; Christophe Dubarry; E. Lagoutte; E. Rolland; Nicolas Bresson; G. Romano; D. Scevola; Viorel Balan; Jérôme Dechamp; Marc Zussy; Gaëlle Mauguen; et al. (3DIC, 2019)

Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields. - Amadine Jouve; Loïc Sanchez; Clément Castan; Nicolas Bresson; Frank Fournel; Nicolas Raynaud; Pascal Metzger (3DIC, 2019)

3D interconnection using copper direct hybrid bonding for GaN on silicon wafer. - Christophe Dubarry; Lucile Arnaud; Maria-Luisa Calvo-Muñoz; Gaëlle Mauguen; Stéphane Moreau; R. Crochemore; Nicolas Bresson; Bernard Aventurier (3DIC, 2021)