TSV development for miniaturized MEMS acceleration switch. - Nicolas Lietaer; Anand Summanwar; Thor Bakke; Maaike Taklo; Per Dalsjø (3DIC, 2010)

3D Integration technology: Status and application development. - Peter Ramm; Armin Klumpp; Josef Weber; Nicolas Lietaer; Maaike Taklo; Walter De Raedt; Thomas Fritzsch; Pascal Couderc (ESSCIRC, 2010)

Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding. - Simon J. Bleiker; Maaike M. Visser Taklo; Nicolas Lietaer; Andreas Vogl; Thor Bakke; Frank Niklaus (Micromachines, 2016)