Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits. - Lionel Cadix; Alexis Farcy; Cédric Bermond; Christine Fuchs; Patrick Leduc; Maxime Rousseau; Myriam Assous; Alexandre Valentian; Julie Roullard; Elie Eid; Nicolas Sillon; Bernard Fléchet; et al. (3DIC, 2009)

3D integration technology for set-top box application. - David Henry; Séverine Cheramy; Jean Charbonnier; Pascal Chausse; Muriel Neyret; Cathy Brunet-Manquat; Sophie Verrun; Nicolas Sillon; Laurent Bonnot; Xavier Gagnard; E. Saugier (3DIC, 2009)

First integration of Cu TSV using die-to-wafer direct bonding and planarization. - Patrick Leduc; Myriam Assous; Léa Di Cioccio; Marc Zussy; Thomas Signamarcheix; Antonio Roman; Maxime Rousseau; Sophie Verrun; Laurent Bally; David Bouchu; Lionel Cadix; Alexis Farcy; et al. (3DIC, 2009)

System on Wafer: A New Silicon Concept in SiP. - Gilles Poupon; Nicolas Sillon; David Henry; Charlotte Gillot; Alan Mathewson; Léa Di Cioccio; Barbara Charlet; Patrick Leduc; Maud Vinet; Perrine Batude (Proc. IEEE, 2009)

A successful implementation of dual damascene architecture to copper TSV for 3D high density applications. - Rebha El Farhane; Myriam Assous; Patrick Leduc; Aurélie Thuaire; David Bouchu; Hélène Feldis; Nicolas Sillon (3DIC, 2010)

3D integration demonstration of a wireless product with design partitioning. - G. Druais; Pascal Ancey; C. Aumont; V. Caubet; Laurent-Luc Chapelon; C. Chaton; Séverine Cheramy; S. Cordova; E. Cirot; Jean-Philippe Colonna; Perceval Coudrain; T. Divel; et al. (3DIC, 2011)