Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology. - Rahul Mathur; Chien-Ju Chao; Rossana Liu; Nikhil Tadepalli; Pranavi Chandupatla; Shawn Hung; Xiaoqing Xu; Saurabh Sinha; Jaydeep Kulkarni (CoRR, 2020)