Interfacial fracture toughness of Pb-free solders. - S. M. Hayes; Nikhilesh Chawla; D. R. Frear (Microelectron. Reliab., 2009)

Mechanisms of deformation in high-ductility Ce-containing Sn-Ag-Cu solder alloys. - H. X. Xie; Nikhilesh Chawla; Yu-Lin Shen (Microelectron. Reliab., 2011)

Data intensive science at synchrotron based 3D x-ray imaging facilities. - Francesco De Carlo; Xianghui Xiao; Kamel Fezzaa; Steve Wang; Nicholas Schwarz; Chris Jacobsen; Nikhilesh Chawla; Florian Fusseis (eScience, 2012)

Mechanical shock behavior of Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce solder joints. - H. X. Xie; Nikhilesh Chawla (Microelectron. Reliab., 2013)

Rapid method for testing efficacy of nano-engineered coatings for mitigating tin whisker growth. - Kyle Doudrick; Jeff Chinn; Jason Williams 006; Nikhilesh Chawla; Konrad Rykaczewski (Microelectron. Reliab., 2015)

In situ fixture for multi-modal characterization during electromigration and thermal testing of wire-like microscale specimens. - James C. E. Mertens; Antony Kirubanandham; Nikhilesh Chawla (Microelectron. Reliab., 2015)

In situ tensile testing of tin (Sn) whiskers in a focused ion beam (FIB)/scanning electron microscope (SEM). - Renuka Vallabhaneni; Ehsan Izadi; Carl R. Mayer; C. Shashank Kaira; Sudhanshu S. Singh; Jagannathan Rajagopalan; Nikhilesh Chawla (Microelectron. Reliab., 2017)

Computational Imaging in 3D X-Ray Microscopy: Reconstruction, Image Segmentation and Time-Evolved Experiments. - Sridhar Niverty; Hamid Torbatissaraf; Viktor V. Nikitin; Vincent De Andrade; Stanislau Niauzorau; Natalia Kublik; Bruno Azeredo; Aniket Tekawade; Francesco De Carlo; Nikhilesh Chawla (ICIP, 2021)