From Talent Shortage to Workforce Excellence in the CHIPS Act Era: Harnessing Industry 4.0 Paradigms for a Sustainable Future in Domestic Chip Production. - Aida Damanpak Rizi; Antika Roy; Rouhan Noor; Hyo Kang; Nitin Varshney; Katja Jacob; Sindia Rivera-Jimenez; Nathan Edwards; Volker J. Sorger; Hamed Dalir; Navid Asadizanjani (CoRR, 2023)

US Microelectronics Packaging Ecosystem: Challenges and Opportunities. - Rouhan Noor; Himanandhan Reddy Kottur; Patrick J. Craig; Liton Kumar Biswas; M. Shafkat M. Khan; Nitin Varshney; Hamed Dalir; Elif Akçali; Bahar Ghane Motlagh; Charles Woychik; Yong-Kyu Yoon; Navid Asadizanjani (CoRR, 2023)

iPROBE: Internal Shielding Approach for Protecting Against Front-Side and Back-Side Probing Attacks. - Minyan Gao; M. Sazadur Rahman; Nitin Varshney; Mark Tehranipoor; Domenic Forte (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2023)

INSPECT: Investigating Supply Chain and Cyber-Physical Security of Battery Systems. - Tao Zhang 108; Shang Shi; Md. Habibur Rahman; Nitin Varshney; Akshay Kulkarni; Farimah Farahmandi; Mark Tehranipoor (IACR Cryptol. ePrint Arch., 2024)

When Everyday Devices Become Weapons: A Closer Look at the Pager and Walkie-talkie Attacks. - Pantha Protim Sarker; Upoma Das; Nitin Varshney; Shang Shi; Akshay Kulkarni; Farimah Farahmandi; Mark Tehranipoor (CoRR, 2025)

Applications and Challenges of AI in PCB X-ray Inspection: A Comprehensive Study. - Antika Roy; Md Mahfuz Al Hasan; Shajib Ghosh; Nitin Varshney; Jake Julia; Reza Forghani; Navid Asadizanjani (ACM J. Emerg. Technol. Comput. Syst., 2025)

Inherent Hardware Identifiers: Advancing IC Traceability and Provenance in the Multi-Die Era. - M. Shafkat M. Khan; Chengjie Xi; Nitin Varshney; Je-Hyeong Bahk; Navid Asadizanjani (J. Electron. Test., 2025)

Toward Standardized Vulnerability Assessment of Advanced Packaging Against Probing Attacks. - M. Shafkat M. Khan; Liton Kumar Biswas; Himanandhan Reddy Kottur; Rouhan Noor; Nitin Varshney; Nelson Hastings; Navid Asadizanjani (IEEE Des. Test, 2025)