Expanded-Beam Through-Substrate Coupling Interface for Alignment Tolerant Packaging of Silicon Photonics. - Nivesh Mangal; Jeroen Missinne; Gunther Roelkens; Joris Van Campenhout; Geert Van Steenberge; Brad Snyder (OFC, 2018)

Packaging and Assembly Challenges for 50G Silicon Photonics Interposers. - Bradley Snyder; Nivesh Mangal; Guy Lepage; Sadhishkumar Balakrishnan; Xiao Sun; Nicolas Pantano; Michal Rakowski; Lieve Bogaerts; Peter De Heyn; Peter Verheyen; Andy Miller; Marianna Pantouvaki; et al. (OFC, 2018)