Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits. - Arief Suriadi Budiman; H.-A.-S. Shin; B.-J. Kim; S.-H. Hwang; Ho-Young Son; Min-Suk Suh; Q.-H. Chung; K.-Y. Byun; Nobumichi Tamura; Martin Kunz; Young-Chang Joo (Microelectron. Reliab., 2012)