Analysis of thermal expansion in elastic and elastoplastic layers subjected to cyclic thermal loading. - K. Wada; Yuji Yagi; I. Nakagawa; T. Atsumi; Nobutada Ohno (Microelectron. Reliab., 2010)

Warpage analysis of layered structures connected by direct brazing. - Takashi Asada; Yuji Yagi; Masanori Usui; T. Suzuki; Nobutada Ohno (Microelectron. Reliab., 2011)

Warpage variations of Si/solder/OFHC-Cu layered plates subjected to cyclic thermal loading. - Hisashi Tanie; Kazuhiko Nakane; Yusuke Urata; Masatoshi Tsuda; Nobutada Ohno (Microelectron. Reliab., 2011)

Fatigue life evaluation of aluminum bonding wire in silicone gel under random vibration testing. - Koji Sasaki; Nobutada Ohno (Microelectron. Reliab., 2013)