Automatic Inspection System for Printed Circuit Boards. - Yasuhiko Hara; Nobuyuki Akiyama; Koichi Karasaki (IEEE Trans. Pattern Anal. Mach. Intell., 1983)

Thermal stability of back side metallization multilayer for power device application. - Takeshi Ito; Isamu Taguchi; Masayasu Soga; Masahiko Mitsuhashi; Toshiro Shinohara; Toshinori Ogashiwa; Takashi Nishimori; Nobuyuki Akiyama (Microelectron. Reliab., 2012)