Non-linear analyses of strain in flip chip packages improved by the measurement using the digital image correlation method. - Toru Ikeda; Toshifumi Kanno; Nobuyuki Shishido; Noriyuki Miyazaki; Hiroyuki Tanaka; Takuya Hatao (Microelectron. Reliab., 2013)

Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures. - Masaki Omiya; Kozo Koiwa; Nobuyuki Shishido; Shoji Kamiya; Chuantong Chen; Hisashi Sato; Masahiro Nishida; Takashi Suzuki; Tomoji Nakamura; Toshiaki Suzuki; Takeshi Nokuo (Microelectron. Reliab., 2013)

Scenario for catastrophic failure in interconnect structures under chip package interaction. - Masaki Omiya; Shoji Kamiya; Nobuyuki Shishido; Kozo Koiwa; Hisashi Sato; Masahiro Nishida; Takashi Suzuki; Tomoji Nakamura; Toshiaki Suzuki; Takeshi Nokuo (IRPS, 2015)