Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developments. - Benjamin Vianne; Pierre Bar; Vincent Fiori; Sebastien Petitdidier; Norbert Chevrier; Sébastien Gallois-Garreignot; Alexis Farcy; Pascal Chausse; Stéphanie Escoubas; Nicolas Hotellier; Olivier Thomas (3DIC, 2013)

Stress management strategy to limit die curvature during silicon interposer integration. - Benjamin Vianne; Alexis Farcy; Vincent Fiori; Cédrick Chappaz; Norbert Chevrier; G. Lobascio; Pascal Chausse; F. Ponthenier; A. Ruckly; Stéphanie Escoubas; Olivier Thomas (3DIC, 2015)