New optical three dimensional structure measurement method of cone shape micro bumps used for 3D LSI chip stacking. - Masahiro Aoyagi; Naoya Watanabe; Motohiro Suzuki; Katsuya Kikuchi; Shunsuke Nemoto; Noriaki Arima; Misaki Ishizuka; Koji Suzuki; Toshio Shiomi (3DIC, 2013)