Iterative optimization of tail breaking force of 1mil wire thermosonic ball bonding processes and the influence of plasma cleaning. - Jae-sik Lee; Michael Mayer; Norman Y. Zhou; S. J. Hong (Microelectron. J., 2007)

Erratum to "Iterative optimization of tail breaking force of 1 mil wire thermosonic ball bonding processes and the influence of plasma cleaning": [Microelectronics Journal 38 (2007) 842-847]. - Jae-sik Lee; Michael Mayer; Norman Y. Zhou; S. J. Hong (Microelectron. J., 2008)

Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging. - Chunjing Hang; Chunqing Wang; M. Mayer; Yanhong Tian; Norman Y. Zhou; Honghui Wang (Microelectron. Reliab., 2008)

Characteristics of Sn8Zn3Bi solder joints and crack resistance with various PCB and lead coatings. - Young Woo Lee; Ki Ju Lee; Norman Y. Zhou; Jae Pil Jung (Microelectron. Reliab., 2008)

Silver pick up during tail formation in thermosonic wire bonding process. - Jae-sik Lee; Michael Mayer; Norman Y. Zhou; S. J. Hong; J. T. Moon (Microelectron. Reliab., 2011)

Influence of gold pick up on the hardness of copper free air ball. - Jae-sik Lee; Michael Mayer; Norman Y. Zhou; J. T. Moon; John Persic (Microelectron. Reliab., 2011)

Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding. - A. Pequegnat; H. J. Kim; M. Mayer; Norman Y. Zhou; John Persic; J. T. Moon (Microelectron. Reliab., 2011)

Role of process parameters on bondability and pad damage indicators in copper ball bonding. - I. Qin; Aashish Shah; C. Huynh; M. Meyer; M. Mayer; Norman Y. Zhou (Microelectron. Reliab., 2011)

Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding. - Aashish Shah; Alireza Rezvani; M. Mayer; Norman Y. Zhou; John Persic; J. T. Moon (Microelectron. Reliab., 2011)

Effect of EFO parameters and superimposed ultrasound on work hardening behavior of palladium coated copper wire in thermosonic ball bonding. - Wan Ho Song; Michael Mayer; Norman Y. Zhou; S. H. Kim; J. S. Hwang; J. T. Moon (Microelectron. Reliab., 2012)

Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding. - Alireza Rezvani; Aashish Shah; M. Mayer; Norman Y. Zhou; J. T. Moon (Microelectron. Reliab., 2013)

Batteryless Wireless Water Leak Detection System. - Oliver Witham; Levi Nathan Johnston; Ming Xiao; Jiayun Feng; Norman Y. Zhou; George Shaker (SmartNets, 2019)

A Novel Programmable Variation-Tolerant RRAM-based Delay Element Circuit. - Kangqiang Pan; Amr M. S. Tosson; Norman Y. Zhou; Lan Wei (NANOARCH, 2021)

A Novel 2T2R CR-based TCAM Design for High-speed and Energy-efficient Applications. - Kangqiang Pan; Amr M. S. Tosson; Ningxuan Wang; Norman Y. Zhou; Lan Wei (ACM Great Lakes Symposium on VLSI, 2022)