Cu pumping in TSVs: Effect of pre-CMP thermal budget. - Ingrid De Wolf; Kris Croes; O. Varela Pedreira; Riet Labie; Augusto Redolfi; M. Van De Peer; Kris Vanstreels; C. Okoro; Bart Vandevelde; Eric Beyne (Microelectron. Reliab., 2011)

Impact of oxide liner properties on TSV Cu pumping and TSV stress. - Joke De Messemaeker; O. Varela Pedreira; A. Moussa; Nabi Nabiollahi; Kris Vanstreels; Stefaan Van Huylenbroeck; Harold Philipsen; Patrick Verdonck; Bart Vandevelde; Ingrid De Wolf; Eric Beyne; Kris Croes (IRPS, 2015)

Reliability Challenges Related to TSV Integration and 3-D Stacking. - Kristof Croes; Joke De Messemaeker; Yunlong Li; Wei Guo; Olalla Varela Pedreira; Vladimir Cherman; Michele Stucchi; Ingrid De Wolf; Eric Beyne (IEEE Des. Test, 2016)

The first observation of p-type electromigration failure in full ruthenium interconnects. - Sofie Beyne; Shibesh Dutta; Olalla Varela Pedreira; Niels Bosman; Christoph Adelmann; Ingrid De Wolf; Zsolt Tökei; Kristof Croes (IRPS, 2018)

Insights into metal drift induced failure in MOL and BEOL. - Chen Wu; O. Varela Pedreira; Alicja Lesniewska; Yunlong Li; Ivan Ciofi; Zsolt Tökei; Kris Croes (IRPS, 2018)

Low-Frequency Noise Measurements to Characterize Cu-Electromigration Down to 44nm Metal Pitch. - Sofie Beyne; Olalla Varela Pedreira; Ingrid De Wolf; Zsolt Tökei; Kristof Croes (IRPS, 2019)

Metal reliability mechanisms in Ruthenium interconnects. - Olalla Varela Pedreira; Michele Stucchi; Anshul Gupta; Victor Vega-Gonzalez; Marleen van der Veen; Stephane Lariviere; Christopher J. Wilson; Zsolt Tökei; Kristof Croes (IRPS, 2020)

Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps. - Alicja Lesniewska; Olalla Varela Pedreira; Melina Lofrano; Gayle Murdoch; Marleen H. van der Veen; Anish Dangol; Naoto Horiguchi; Zsolt Tökei; Kris Croes (IRPS, 2021)

Electromigration limits of copper nano-interconnects. - Houman Zahedmanesh; Olalla Varela Pedreira; Zsolt Tokei; Kristof Croes (IRPS, 2021)

Assessment of critical Co electromigration parameters. - O. Varela Pedreira; Melina Lofrano; Houman Zahedmanesh; Philippe J. Roussel; Marleen H. van der Veen; Veerle Simons; Emmanuel Chery; Ivan Ciofi; Kris Croes (IRPS, 2022)

First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP. - Gayle Murdoch; Matin O'Toole; Giulio Marti; Ankit Pokhrel; Diana Tsvetanova; Stefan Decoster; Shreya Kundu; Yusuke Oniki; Arame Thiam; Quoc Toan Le; Olalla Varela Pedreira; Alicja Lesniewska; et al. (VLSI Technology and Circuits, 2022)

Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters. - Youqi Ding; O. Varela Pedreira; Melina Lofrano; Houman Zahedmanesh; T. Chavez; Hosain Farr; Ingrid De Wolf; Kris Croes (IRPS, 2023)

Towards accurate temperature prediction in BEOL for reliability assessment (Invited). - Melina Lofrano; Herman Oprins; Xinyue Chang; Bjorn Vermeersch; Olalla Varela Pedreira; Alicja Lesniewska; Vladimir Cherman; Ivan Ciofi; Kristof Croes; Seongho Park; Zsolt Tokei (IRPS, 2023)

Challenges for Interconnect Reliability: From Element to System Level. - Olalla Varela Pedreira; Houman Zahedmanesh; Youqi Ding; Ivan Ciofi; Kristof Croes (ISPD, 2023)

De-Coupling Thermo-Migration from Electromigration Using a Dedicated Test Structure. - O. Varela Pedreira; Youqi Ding; D. Coenen; Philippe Roussel; Ahmed Sobhi Saleh; Veerle Simons; Houman Zahedmanesh; Ivan Ciofi; Kris Croes (IRPS, 2024)

Mitigating Line-Break Defectivity with a Sandwiched TiN or W Layer for Metal Pitch 18 NM Aspect Ratio 6 Semi-Damascene Interconnects. - Anshul Gupta; Shreya Kundu; Stefan Decoster; K. Sah; G. Delie; B. Truijen; Davide Tierno; Giulio Marti; O. Varela Pedreira; B. Kenens; Y. Hermans; C. Adelmann; et al. (VLSI Technology and Circuits, 2024)

Leakage and TDDB Mechanisms in 18 nm Pitch Direct Metal Etch Ru Interconnects with Airgaps. - Alicja Lesniewska; Y. Fang; G. Delie; Philippe Roussel; Koen Van Sever; Emmanuel Chery; O. Varela Pedreira; Ivan Ciofi; S. H. Park; Zsolt Tokei; Kris Croes (IRPS, 2025)