Reliability modelling for packages in flexible end-products. - W. D. van Driel; Olaf van der Sluis; Dao-Guo Yang; R. L. J. M. Ubachs; C. Zenz; G. Aflenzer; G. Q. Zhang (Microelectron. Reliab., 2006)

Multiscale modelling of multilayer substrates. - R. L. J. M. Ubachs; Olaf van der Sluis; W. D. van Driel; G. Q. Zhang (Microelectron. Reliab., 2006)

Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. - Cadmus A. Yuan; Willem D. van Driel; Richard B. R. van Silfhout; Olaf van der Sluis; Roy A. B. Engelen; Leo J. Ernst; Fred van Keulen; G. Q. Zhang (Microelectron. Reliab., 2006)

Analysis of Cu/low-k bond pad delamination by using a novel failure index. - Marcel A. J. van Gils; Olaf van der Sluis; G. Q. Zhang; J. H. J. Janssen; R. M. J. Voncken (Microelectron. Reliab., 2007)

Cohesive zone modeling for structural integrity analysis of IC interconnects. - B. A. E. van Hal; Ron H. J. Peerlings; Marc G. D. Geers; Olaf van der Sluis (Microelectron. Reliab., 2007)

Characterization of moisture properties of polymers for IC packaging. - Xiaosong Ma; Kaspar M. B. Jansen; Leo J. Ernst; W. D. van Driel; Olaf van der Sluis; G. Q. Zhang (Microelectron. Reliab., 2007)

Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion. - Olaf van der Sluis; R. A. B. Engelen; Richard B. R. van Silfhout; W. D. van Driel; Marcel A. J. van Gils (Microelectron. Reliab., 2007)

Molecular simulation on the material/interfacial strength of the low-dielectric materials. - Cadmus A. Yuan; Olaf van der Sluis; G. Q. (Kouchi) Zhang; Leo J. Ernst; Willem D. van Driel; Richard B. R. van Silfhout (Microelectron. Reliab., 2007)

Characterization of semiconductor interfaces using a modified mixed mode bending apparatus. - J. Thijsse; Olaf van der Sluis; J. A. W. van Dommelen; Willem D. van Driel; Marc G. D. Geers (Microelectron. Reliab., 2008)

The need for multi-scale approaches in Cu/low-k reliability issues. - Cadmus A. Yuan; Olaf van der Sluis; Willem D. van Driel; G. Q. (Kouchi) Zhang (Microelectron. Reliab., 2008)

Numerical prediction of failure paths at a roughened metal/polymer interface. - S. P. M. Noijen; Olaf van der Sluis; P. H. M. Timmermans; G. Q. Zhang (Microelectron. Reliab., 2009)

Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics. - Olaf van der Sluis; R. A. B. Engelen; P. H. M. Timmermans; G. Q. Zhang (Microelectron. Reliab., 2009)

A fast moisture sensitivity level qualification method. - Xiaosong Ma; Kaspar M. B. Jansen; G. Q. Zhang; Willem D. van Driel; Olaf van der Sluis; Leo J. Ernst; C. Regards; Christian Gautier; Hélène Frémont (Microelectron. Reliab., 2010)

Prediction of the epoxy moulding compound aging effect on package reliability. - Sander Noijen; Roy Engelen; Joerg Martens; Alexandru Opran; Olaf van der Sluis; Richard B. R. van Silfhout (Microelectron. Reliab., 2010)

Design and implementation of flexible and stretchable systems. - Mario Gonzalez; Bart Vandevelde; Wim Christiaens; Yung-Yu Hsu; François Iker; Frederick Bossuyt; Jan Vanfleteren; Olaf van der Sluis; P. H. M. Timmermans (Microelectron. Reliab., 2011)

Isogeometric-Mechanics-Driven Electrophysiology Simulations of Ventricular Tachycardia. - Robin Willems; Evianne Kruithof; Koen L. P. M. Janssens; Matthijs J. M. Cluitmans; Olaf van der Sluis; Peter H. M. Bovendeerd; Clemens V. Verhoosel (FIMH, 2023)

Towards a real-time simulation of elastoplastic deformation using multi-task neural networks. - Ruben Schmeitz; Joris J. C. Remmers; Olga Mula; Olaf van der Sluis (Adv. Model. Simul. Eng. Sci., 2024)

A probabilistic reduced-order modeling framework for patient-specific cardio-mechanical analysis. - Robin Willems; Peter Förster; Sebastian Schöps; Olaf van der Sluis; Clemens V. Verhoosel (Comput. Biol. Medicine, 2025)