Extraction of elastic-plastic material properties of thin films through nanoindentaion technique with support of numerical methods. - Lukasz Dowhan; Artur Wymyslowski; Pawel Janus; Magdalena Ekwinska; Olaf Wittler (Microelectron. Reliab., 2011)

Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination. - O. Hölck; Jörg Bauer 002; Olaf Wittler; Bernd Michel; Bernhard Wunderle (Microelectron. Reliab., 2012)

Degradation of moulding compounds during highly accelerated stress tests - A simple approach to study adhesion by performing button shear tests. - Reinhard Pufall; Michael Goroll; Joachim Mahler; Werner Kanert; M. Bouazza; Olaf Wittler; Rainer Dudek (Microelectron. Reliab., 2012)

Transport of moisture at epoxy-SiO2 interfaces investigated by molecular modeling. - O. Hölck; Jörg Bauer 002; Tanja Braun; Hans Walter; Olaf Wittler; Bernhard Wunderle; Klaus-Dieter Lang (Microelectron. Reliab., 2013)

Improving the FE simulation of molded packages using warpage measurements. - Saskia Huber; Marius van Dijk; Hans Walter; Olaf Wittler; Tina Thomas; Klaus-Dieter Lang (Microelectron. Reliab., 2014)

Microstructural evolution of ultrasonic-bonded aluminum wires. - Marian Sebastian Broll; Ute Geissler; Jan Höfer; Stefan Schmitz; Olaf Wittler; Klaus-Dieter Lang (Microelectron. Reliab., 2015)

Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding. - Marian Sebastian Broll; Ute Geissler; Jan Höfer; Stefan Schmitz; Olaf Wittler; Martin Schneider-Ramelow; Klaus-Dieter Lang (Microelectron. Reliab., 2015)

Laser cuts increase the reliability of heavy-wire bonds and enable on-line process control using thermography. - A. Middendorf; A. Grams; S. Janzen; Klaus-Dieter Lang; Olaf Wittler (Microelectron. Reliab., 2017)