Investigation of the influence of thermal treatment on interconnect-barrier interfaces in copper metallization systems. - Oliver Aubel; Eberhard Bugiel; Dietmar Krüger; Wolfgang Hasse; Martina Hommel (Microelectron. Reliab., 2006)

Simulation of migration effects in nanoscaled copper metallizations. - Kirsten Weide-Zaage; Farzan Kashanchi; Oliver Aubel (Microelectron. Reliab., 2008)

Determination of migration effects in Cu-via structures with respect to process-induced stress. - Kirsten Weide-Zaage; Jiani Zhao; Joharsyah Ciptokusumo; Oliver Aubel (Microelectron. Reliab., 2008)

Investigation of stress distribution in via bottom of Cu-via structures with different via form by means of submodeling. - Joharsyah Ciptokusumo; Kirsten Weide-Zaage; Oliver Aubel (Microelectron. Reliab., 2009)

Empirical BEOL-TDDB evaluation based on I(t)-trace analysis. - Oliver Aubel; Armand Beyer; Georg Talut; Martin Gall (Microelectron. Reliab., 2014)

Robust Electromigration reliability through engineering optimization. - Wee Loon Ng; Kheng Chok Tee; Junfeng Liu; Yong Chiang Ee; Oliver Aubel; Chuan Seng Tan; Kin Leong Pey (Microelectron. Reliab., 2014)

A quantitative study of Phosphorous implantation damage on the thick gate oxide of the 28 nm node. - Xinggong Wan; Sandhya Chandrashekhar; Boris Bayha; Martin Trentzsch; Torben Balzer; Mahesh Siddabathula; Oliver Aubel (Microelectron. Reliab., 2014)