Board level investigation of BGA solder joint deformation strength. - Bálint Sinkovics; Olivér Krammer (Microelectron. Reliab., 2009)

Improved method for determining the shear strength of chip component solder joints. - Olivér Krammer; Bálint Sinkovics (Microelectron. Reliab., 2010)

Modelling the effect of uneven PWB surface on stencil bending during stencil printing process. - Olivér Krammer; László Milán Molnár; László Jakab; András Szabó (Microelectron. Reliab., 2012)

Solder Paste Scooping Detection by Multilevel Visual Inspection of Printed Circuit Boards. - Csaba Benedek; Olivér Krammer; Mihály Janoczki; László Jakab (IEEE Trans. Ind. Electron., 2013)

Modelling the self-alignment of passive chip components during reflow soldering. - Olivér Krammer (Microelectron. Reliab., 2014)

Automatic characterisation method for statistical evaluation of tin whisker growth. - Olivér Krammer; Balázs Illés; Réka Bátorfi; Karel Dusek (Microelectron. Reliab., 2017)

Microelectronics education in Europe in 21st century. - Slavka Tzanova; Attila Géczy; Olivér Krammer; Péter Martinek; Zholt Lyefalvi-Vitez; Mile Stankovski; Rosario Gil 001; Manuel Castro Gil; Norocel Codreanu (EDUCON, 2018)

Analysing machine learning techniques for predicting the hole-filling in pin-in-paste technology. - Péter Martinek; Olivér Krammer (Comput. Ind. Eng., 2019)

Analyzing the Overfitting of Boosted Decision Trees for the Modelling of Stencil Printing. - Péter Martinek; Olivér Krammer (Period. Polytech. Electr. Eng. Comput. Sci., 2022)

Can ChatGPT Help in Electronics Research and Development? A Case Study with Applied Sensors. - Zoltán Tafferner; Balázs Illés; Olivér Krammer; Attila Géczy (Sensors, 2023)

Assessing Temperature Sensitivity and Ring Oscillator Count Impact on Configurable Ring Oscillator PUF Performance. - Husam Kareem; Olivér Krammer; Dmitriy Dunaev (MECO, 2024)